Shipping Estimate
USA
- USA
- CAN
- USA
- CAN
Ships within 48 hours · Estimated delivery Jul 13 - Jul 18
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Description
I2C T18 PCB Pre-heating Station for iPhone X-15Pro Max Android CPU Chip Degumming Motherboard Layered Desoldering PlatformiProGadgets Repair Tools I2C T18 PCB Pre heating Station for iPhone X 15Pro Max Android CPU Chip Degumming Motherboard Layered Desoldering Platform Features: T18 PCB motherboard desoldering station, magnetic modular design, constant temperature desoldering, and explosion tin proof LCD HD screen display, 2Gears of temp adjustment, Supports iPhone X to 15Pro Max motherboard separation, chip CPU glue removal, and other functions Aviation aluminum
iProGadgets Repair Tools I2C T18 PCB Pre-heating Station for iPhone X-15Pro Max Android CPU Chip Degumming Motherboard Layered Desoldering Platform
Features:
T18 PCB motherboard desoldering station, magnetic modular design, constant temperature desoldering, and explosion-tin proof
LCD HD screen display, 2Gears of temp adjustment, Supports iPhone X to 15Pro Max motherboard separation, chip CPU glue removal, and other functions
Aviation aluminum material, CNC precision processing, high-temperature resistance, and oxidation resistance
Rapid heating, matched with PTC ceramic heating pieces, it can heat up to 180C in 60 seconds rapidly
Module strong magnetic automatic adsorption, module replacement as you wish, simple and more convenient
Put the chip on and switch to 245℃, then use a brush to remove the glue and tin residue on the chip, it can be adapted to 98%of the chips and can meet the needs of 98%of IC glue removal and desoldering on the market.
Only one host can support multiple modules, support Apple and Android double-layer motherboard layering, fit, and repair, and can also be applied to the repair of various precision electronic and digital products
Specification:
Model: T18
Name: T18 PCB motherboard desoldering station
Supply Voltage: AC 110V~220V
Minimum temperature: 180°C
Display: LED digital display
Maximum temperature: 245℃
Body size: 134*116*17mm
Scope of use: Motherboard separation and bonding
Packing size: 214*143*80mm
Shipping Notes
- Free Standard Shipping on $100+ Orders to the USA.
- Except Preorder products are shipped in 48 hours.
- Delivery to the USA:
- Standard Shipping : 3-10 business days
- If time is of the essence, please consider selecting expedited delivery for faster service.
Exchange/Return Notes
- We offer a 30-day return/exchange service after receiving.
- Final sale items are not eligible for returns or exchanges.
- To process your return/exchange, please contact us at [email protected]
- Please click here for more details>>> Return & Exchange Policy